JPH0337266Y2 - - Google Patents
Info
- Publication number
- JPH0337266Y2 JPH0337266Y2 JP18108884U JP18108884U JPH0337266Y2 JP H0337266 Y2 JPH0337266 Y2 JP H0337266Y2 JP 18108884 U JP18108884 U JP 18108884U JP 18108884 U JP18108884 U JP 18108884U JP H0337266 Y2 JPH0337266 Y2 JP H0337266Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- cover
- case
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18108884U JPH0337266Y2 (en]) | 1984-11-28 | 1984-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18108884U JPH0337266Y2 (en]) | 1984-11-28 | 1984-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6196592U JPS6196592U (en]) | 1986-06-21 |
| JPH0337266Y2 true JPH0337266Y2 (en]) | 1991-08-07 |
Family
ID=30738643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18108884U Expired JPH0337266Y2 (en]) | 1984-11-28 | 1984-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337266Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12139609B2 (en) | 2018-09-28 | 2024-11-12 | Zeon Corporation | Resin composition comprising thermoplastic plastomer and hollow resin particles and molded product thereof |
-
1984
- 1984-11-28 JP JP18108884U patent/JPH0337266Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6196592U (en]) | 1986-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10251285B2 (en) | Electronic apparatus unit | |
| JP2001244656A (ja) | 電子回路基板の収容ケース | |
| JPH0337266Y2 (en]) | ||
| JPH046233Y2 (en]) | ||
| JPH0719194Y2 (ja) | 電磁シールド装置 | |
| JPH0760940B2 (ja) | 電子機器用プリント基板のケーシング装置 | |
| JPS614484U (ja) | パツケ−ジシエルフ | |
| JPS6316142Y2 (en]) | ||
| JPH0244542Y2 (en]) | ||
| JPS6041749Y2 (ja) | カバ−の取付構造 | |
| JPH0235543Y2 (en]) | ||
| JPH0249752Y2 (en]) | ||
| JPH0371799B2 (en]) | ||
| JPS5839030Y2 (ja) | 端子貫通部の防水機構 | |
| JPH0349437Y2 (en]) | ||
| JPH0124957Y2 (en]) | ||
| JPS5911484Y2 (ja) | プリント基板の支持装置 | |
| JPH0635495Y2 (ja) | プリントボードの組立構造 | |
| JP2734377B2 (ja) | プリンタのプリント基板固定構造 | |
| JPS6344919Y2 (en]) | ||
| JPH0212657Y2 (en]) | ||
| JP2584960Y2 (ja) | プリント基板の保持ケース構造 | |
| JPS5832286Y2 (ja) | 部品取付装置 | |
| JPH051285U (ja) | 放熱プレート | |
| JPS5943659Y2 (ja) | 接栓座 |